Packaging Compliance Labs is delighted to inform students pursuing education in engineering that they are starting a scholarship program for packaging engineers for Winter 2021. To enter the program, the scholarship asks candidates to complete the application procedure of the subsequent grant and provide an original and creative answer to the questions asked in the application form. The winner of the following grant will be decided by the Vice President, Ryan Erickson, and the scholarship team of medical device packaging engineers. The winner will be awarded a one-time scholarship amount of $2,000 towards their packaging engineering education.
To be eligible for this scholarship, the candidate must be a packaging engineering college student enrolled in any college/university with a packaging engineering program. The overall purpose of the subsequent grant is to help and provide monetary support to the packaging engineers by reducing their financial burden to cover the high educational costs of professional courses like packaging engineering. The deadline of the scholarship of the following scholarship is November 12, 2021, and the winner will be announced by December 10, 2021.
Packaging Compliance Labs was first established in the city named by Forbes as 2018’s #1 in Best Cities for Raising a Family U.S. rankings, Grand Rapids, Michigan. They have brought their pioneering and packaging engineering backgrounds together to make a full-administration, ISO 17025-certify worldwide packaging engineering, and testing firm. Its mission is to deliver solutions that enable life-changing medical innovation.
Brief Description
Following is the brief description of the following scholarship:
| Organization | Packaging Compliance Labs |
| Education Level | College and university |
| Subjects | Engineering |
| Amount | $2,000 |
| Access Mode | Online |
| Number of Awards | 1 |
| City | Any |
| Nationality | Domestic |
| Country | USA |
| Contest Deadline | November 12, 2021 |
| Application Fees | Not required |
| Requirements | Essay, proof of enrolment |
Who is Eligible?
All packaging engineering college students enrolled in any college/university with a packaging engineering program are encouraged to apply for the following scholarship program.
How to Apply?
To enter the program, the interested individuals need to fill out the application form given on the scholarship portal and submit their Prompt response of 300 words to any two of the following questions:
- What inspired you to pursue a career in medical device packaging engineering?
- What is an innovation you think the medical device packaging engineering industry needs to make?
- Tell us about a class project or co-op/internship project you worked on that taught you the most?
- What is your philosophy on the packaging?
- When was a time you were presented with a problem to solve that seemed out of the scope of your experience? How did you solve it, and what did you learn?
Supporting Documents
Following are the documents that need to be attached with your application form:
- Show proof of enrolment to their university and program
- Proof they have completed an internship with a medical device company or medical device packaging firm.
Benefits
The applications and documents submitted by you will be reviewed and verified. After verification, the one most deserving candidate will be chosen and be awarded the one-time scholarship money of $2,000.
Application Deadline
The deadline for the application submission for the following contest is November 12, 2021. No applications will be considered after this date.
