PCB Solutions is offering the opportunity to apply for its Ai Engstrom National Scholarship. The award program is open for all legal residents of the United States who have a desire to attain an undergraduate degree at an accredited college in the US.
The scholarship was created in tribute to former employee Chuan Ai Lu Engstrom who passed away in 2014 from uterine cancer. Ai emigrated from China after marrying PCB Solutions’ president Greg Engstrom and became an American citizen.
PCB Solutions offers high-quality printed circuit board manufacturing to meet a variety of needs in the dynamic electronics industry. It offers competitive solutions for the customers and has established domestic and off-shore relationships with several high-quality and reliable fabricators.
Table of Contents
Brief Description
| Organization | PCB Solutions |
| Educational Level | Undergraduate |
| Subjects | All |
| Amount | $1000 |
| Access Mode | Online |
| Number of Awards | 1 |
| City | All |
| Nationality | Domestic |
| Country | United States |
| Application Deadline | August 1 and December 1 |
| Application Fees | Nil |
| Requirements | CV, essay |
Who May Be Eligible?
To be eligible, the applicants must match all the following criteria:
- Any current, full-time aspirants of an accredited American university and college students are eligible to apply.
- Applicants must attain a minimum cumulative GPA of at least 2.5, is welcome to apply.
- There is no age requirement.
How to Apply
All candidates need to submit an essay of no less than 800 words about the following topic Email your article via word doc or pdf to cameron@pcb-solutions.com:
- Discuss your vision of electronic design, engineering, and manufacturing in the global economy.
Benefits
The winner selected will receive a $1000 scholarship to the college of their attendance. The scholarship funds awarded can be used for school-related expenses of the student’s choice. Once awarded, the check will be written to the applicant’s enrolled school and credited for academic costs.
Application Deadline
The Application submission deadline is August 1st for the fall semester and December 1st for the spring semester.
